Specialized
in System Semiconductor.

NEPES ARK

Test Solution

  • Pad Test
  • Bumping

  • Wafer Test
  • Assembly
  • Final Test
  • Final Product

TEST Total Solution Provider

  • Test Program Development

  • Wafer Probe Test

  • Probe card, PIB Development & Maintenance

  • Package Final Test

  • Intelligent IT system Infra support

  • Turn-key service(BUMP – TEST – PACKAGE)

  • System U/I Development

Application & Portfolio

  • SYSTEM IC Image
    SYSTEM IC
    MCU SoC DSP, ISP AI Custom IC Audio
  • PMIC (Power Management IC) Image
    PMIC (Power Management IC)
    Mobile Phone LED Lighting Automotive Battery Charger SSD
  • RF Image
    RF
    Wireless Transceiver 5G RF
  • DDI (Display Driver IC) Image
    DDI (Display Driver IC)
    Monitor,
    Laptop PC     Mobile Phone,
    Tablet PC     LCD/OLED TV Automotive Display Panel
  • system ic Image
    CIS(CMOS Image Sensor)
    Mobile Phone Laptop PC, Tablet PC Black Box Security Automotive
  • system ic Image
    IoT & Sensor
    Controller Memory Touch Sensor Security MCU

Full Turn-key Solutions of
 Bumping, WLP, FOWLP/PLP, SiP and Test 

nepes

offers Advanced Assembly & Test manufacturing services including wafer bumping, WLP and SiP technologies for our global fabless and integrated device manufacturer customers. Our full turn-key services additionally offer design, characterization, back-end processing, and electrical test.

nepes

uses its cutting-edge manufacturing process technologies to reinforce the portfolio of its products: WLP, fan-out WLP, fan-out WLSiP, advanced fan-out PLP, and 2D, 3D modules.

nepes

operates fabs in Cheongju and Cheongan in Chungcheongbuk-do, Manila, Philippines, and Jiangsu, China and listens to the voices of its customers at home and abroad while operating overseas offices in San Diego, USA and Shanghai, China.